Features
- Use various Laser source as UV, Green, IR, etc.
- Cutting materials : FR4, FPCBs, Kapton, etc.
- Thickness up to 1.2mm in the case of FR4 PCB
- Pin Table, Production fixture
- Full-cut process, Support high populated PCB panel
- Best cutting quality(Minimize charring)
- Clean process of particle and fume removal
Options
- Easy setup of BDS(Beam Delivery System)
- Automated Laser power management
- Apply the optimized optic system
- Incredible cost performance using 2 Table
- Full graphic interface and easy programming
- Real-time monitoring of key process parameters